Glue dispenser for IC CHIP,component under fill and component encapsulation

Broadband glue/solder paaste dispenser D3.
Application Range:
# Encapsulation defense of PCB board as well as FPC soft board components,
# Reinforcement of cam component, finger print acknowledgment component
# Dispensing IC chip, element underfill and also element
# Encapsulation covering structure giving
# Red phosphor, dam, accuracy covering, and so on.